GIGABYTE B760M DS3H
Intel Socket LGA 1700
Support 13th and 12th Gen Series Processors
Unparalleled Performance
Hybrid 6+2+1 Phases Digital VRM Solution
Dual Channel DDR5
4*DIMMs XMP Memory Module Support
Next Generation Storage
2*PCIe 4.0 x4 M.2 Connectors
M.2 Thermal Guard
To Ensure M.2 SSD Performance
EZ-Latch
PCIe 4.0×16 Slot with Quick Release Design
Fast Networks
2.5GbE LAN
Extended Connectivity
Rear USB-C 10Gb/s, DP, HDMI
Smart Fan 6
Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
Q-Flash Plus
Update BIOS Without Installing the CPU, Memory and Graphics Card
Ražotāja mājaslapa
Specifikācija |
|
| Model | B760M DS3H |
| Chipset | Intel B760 Express |
| Socket | LGA1700 |
| Form Factor | Micro-ATX |
| Memory type | DDR5 |
| Frequency speed | 4000/4800/5200/5400/5600/5800/6000/6200/6400/6600/6800/7000/7200/7400/7600MHz |
| Memory slots | 4 |
Expansion slots |
|
| M.2 | 2 |
| PCI-Express 3.0 1x | 2 |
| PCI-Express 4.0 16x | 1 |
Input/Output connectors |
|
| 15pin D-sub | 1 |
| Audio port | 3 |
| DisplayPort | 2 |
| HDMI | 1 |
| PS/2 | 1 |
| RJ45 | 1 |
| USB 2.0 | 2 |
| USB 3.2 | 3 |
| USB-C | 1 |
Interface |
|
| SATA | Yes |
| USB 2.0 | Yes |
| USB 3.2 | Yes |
| Integrated video | Depending on CPU |
| Integrated LAN | 2.5 Gigabit |
| Integrated audio | Yes |
| RAID | SATA 0, 1, 5, 10 |
| TPM | Header |
| Shipping box quantity | 1 |
Shipping/Package Box Dimensions |
|
| Shipping Box Depth | 27cm |
| Shipping Box Height | 5.5cm |
| Shipping Box Weight | 0.97kg |
| Shipping Box Width | 27cm |
| Unit Brutto Volume | 0.00401cubm |
| Unit Net Weight | 0.75kg |
| Unit Gross Weight | 0.97kg |
Intel B760 Express|LGA1700|Micro-ATX|DDR5|7600/7400/7200/7000/6800/6600/6400/6200/6000/5800/5600/5400/5200/4800/4000 MHz|Memory slots 4|2xPCI-Express 3.0 1x|1xPCI-Express 4.0 16x|2xM.2|1x15pin D-sub|1xHDMI|2xDisplayPort|2xUSB 2.0|3xUSB 3.2|1xUSB-C|1xPS/2|1xRJ45|3xAudio port|SATA|USB 2.0|USB 3.2|Video Depending on CPU|LAN 2.5 Gigabit|Audio|RAID SATA 0, 1, 5, 10|TPM Header















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