- Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors
- Unparalleled Performance:Hybrid 6+2+1 Phases Digital VRM Solution
- Dual Channel DDR5:4*DIMMs XMP Memory Module Support
- Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors
- M.2 Thermal Guard:To Ensure M.2 SSD Performance
- EZ-Latch:PCIe 4.0×16 Slot with Quick Release Design
- Fast Networks:2.5GbE LAN & Wi-Fi 6E 802.11ax
- Extended Connectivity:Rear USB-C® 10Gb/s, DP, HDMI
- Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
Specifikācija |
|
Model | B760M DS3H AX 1.2 |
Chipset | Intel B760 Express |
Socket | LGA1700 |
Form Factor | Micro-ATX |
Memory type | DDR5 |
Frequency speed | 4000/4600/4800/5200/5400/5600/5800/6000/6800/7000/7200/7400/7600MHz |
Memory slots | 4 |
Expansion slots |
|
M.2 | 2 |
PCI-Express 3.0 1x | 2 |
PCI-Express 4.0 16x | 1 |
Input/Output connectors |
|
Audio-In | 2 |
Audio-Out | 1 |
DisplayPort | 2 |
HDMI | 1 |
PS/2 | 1 |
RJ45 | 1 |
USB 2.0 | 2 |
USB 3.2 | 3 |
USB-C | 1 |
Interface |
|
Bluetooth | Yes |
SATA | Yes |
WiFi | Yes |
Integrated video | Yes |
Integrated LAN | 2.5 Gigabit |
Integrated audio | Yes |
RAID | SATA 0, 1, 5, 10 |
TPM | Header |
Shipping box quantity | 10 |
Shipping/Package Box Dimensions |
|
Shipping Box Depth | 55cm |
Shipping Box Height | 30cm |
Shipping Box Weight | 12.35kg |
Shipping Box Width | 38cm |
Unit Brutto Volume | 0.00627cubm |
Unit Net Weight | 0.75kg |
Unit Gross Weight | 1.23kg |
MBI
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